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Mechanical grade silicon wafer |
Item |
Unit |
4” Wafer |
5” Wafer |
6” Wafer |
8” Wafer |
12” Wafer |
Diameter |
±0.5mm |
100 |
125 |
150 |
200 |
300 |
Growth Method |
|
CZ & FZ |
CZ & FZ |
CZ & FZ |
CZ & FZ |
CZ & FZ |
Orientation |
±1° |
1-0-0 / 1-1-1 |
1-0-0 / 1-1-1 |
1-0-0 / 1-1-1 |
1-0-0 / 1-1-1 |
1-0-0 / 1-1-1 |
Type |
|
P/N |
P/N |
P/N |
P/N |
P/N |
Dopant |
|
*Bo/Phos/Ant/Ars. |
Resistivity |
Ω-cm |
0~100 |
0~100 |
0~100 |
0~100 |
0~100 |
Edge profile |
|
T-type / R-type |
O. F. Cut |
±1° |
1-1-0 |
1-1-0 |
1-1-0 |
1-1-0 |
1-1-0 |
O. F . Cut flatness |
mm |
32.5±2.5 |
32.5±2.5 |
Semi / Jeida |
V - Notch |
V - Notch |
Thickness |
μm |
≧350 |
≧450 |
≧500 |
≧550 |
≧600 |
TTV |
μm |
N/A |
N/A |
N/A |
N/A |
N/A |
STIR |
μm |
N/A |
N/A |
N/A |
N/A |
N/A |
Bow / Warpage |
μm |
N/A |
N/A |
N/A |
N/A |
N/A |
Particle |
|
SEMI |
SEMI |
SEMI |
SEMI |
SEMI |
Edge exclusion |
mm |
N/A |
5 |
5 |
3 |
3 |
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Polished |
Polished |
Polished |
Polished |
Back side surface |
|
*Se/La/Et/Po |
Stain, Depth Scratch |
|
Free |
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WE have our own processing line with ability forStripping Dice, Broken Wafer,
Broken Solar Cell, and Broken Solar Wafer . |
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益銓國際有限公司 Yia Chuan International Co., Ltd. |
• 1F,No.147,Hsichou St., Chungli City, Taoyuan County , Taiwan |
•Tel:+886-3-4521569 •Fax:+886-3-4519810 •E-mail:service@ycicorp.com.tw |
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